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Gold Bonding Wire
Merit:
• Au bonding wire for stable stitch bond
• Supper low loop Au bonding wire
• High strength Au bonding wire
• Au bonding wire for fine pitch bonding
Classification
| Classification | Characteristics | Areas of application |
| WS-G01 | Good 2nd bond stitch remaining after pull test | QFN、QFP、BGA package |
| WS-G02 | High strength,good loop stability, good bump formation for a stack die package, applicable for multiple loop profiles in BGA | Long/short loop、Stacked package、Flat integrated circuits |
| WS-G03 | Lower loop height,less damage at neck region，good high temperature strength | Low loop , Flat integrated circuits COB, foil frames |
| WS-G04 | Small deformation of squashed ball by ultrasonic frequency | Applicable for narrow pad pitch bonding |
Mechanical Properties
| Classification | Characteristics | Areas of application | |||||||
| mil | um | WS-AU01 | WS-AU02 | WS-AU03 | WS-AU04 | WS-AU01 | WS-AU02 | WS-AU03 | WS-AU04 |
| 0.6 | 15 | 2-5 | 2-5 | 2-5 | 2-5 | >2.5 | >3.0 | >3.5 | >4.0 |
| 0.7 | 18 | 2-5 | 2-5 | 2-5 | 2-5 | >2.5 | >3.5 | >4.0 | >5.0 |
| 0.8 | 20 | 2-6 | 2-6 | 2-6 | 2-6 | >4.0 | >4.5 | >6.0 | >6.0 |
| 0.9 | 23 | 2-7 | 2-7 | 2-7 | 2-7 | >5.0 | >6.0 | >8.0 | >8.0 |
| 1.0 | 25 | 2-8 | 2-8 | 2-8 | 2-8 | >7.0 | >8.0 | >10.0 | >10.0 |
| 1.2 | 30 | 3-8 | 3-8 | 3-8 | 3-8 | >11.0 | >12.0 | >13.0 | >15.0 |
| 1.3 | 33 | 3-9 | 3-9 | 3-9 | 3-9 | >13.0 | >14.0 | >16.0 | >18.0 |
| 1.5 | 38 | 3-10 | 3-10 | 3-10 | 3-10 | >17.0 | >18.0 | >21.0 | >22.0 |
| 1.7 | 43 | 3-11 | 3-11 | 3-11 | 3-11 | >22.0 | >24.0 | >26.0 | >28.0 |
| 2.0 | 50 | 3-12 | 3-12 | 3-12 | 3-12 | >30.0 | >32.0 | >34.0 | >36.0 |
TDS for Au Wire
| Main Purity | 4N Au | 2N Au | |
| Wire Type | WS-G01,02,03 | WS-G04 | |
| Hardness(Hv) | FAB | 42 ~47 | 40 ~ 50 |
| Wire | 47 ~52 | 50 ~ 60 | |
| Fusing Current(A)(±0.02A,Length=10mm) | 0.28 ~ 1.37 | 0.28 ~ 1.35 | |
| Resistivity(uΩ Cm) | 2.3 | 2.9 | |
| Recrystalization Temp.(℃) | 500 ~ 550 | 500 ~ 550 | |
| Elastic Modulus(Gpa) | 70 ~ 80 | 70 ~80 | |
| Melting Point(℃) | 1050 ~1080 | 1050 ~1080 | |
| Density(gr/cm²) | 19.32 | 19.2 | |
| Cofficient of Linear thermal Expansion(20~100℃) | 13 ~ 15 x 10-6 | 13 ~ 15 x 10-6 | |
| Shelf Life(From data of Manufacturing/day) | 2 Years | 2 Years | |
| Floor Life(Opened from PET PACK) | 4Weeks | 4Weeks | |
Product application
| BGA Package Application | Short Loop Application |
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G02 Wire Diameter:20um Loop Length:1.0&4.0mm |
G03 Wire Diameter:20um Loop Length:0.8mm |
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| Fine pitch Application Small pitch bonding G04 Wire Diameter:20um | ||
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| Die to die |
IC-card module with chip and bonding wire connection |
BGA assembling |
