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Copper Bonding Wire
• Low price
• Good mechanical properties,electrical conductivity and loop stability
• Intermetallic compound growth slowly
• Applied to discrete components (SOT, SOP,TO,QFN...)Integrated circuits
Classification
| Classification | Characteristics | Areas of application | |
| 4N | WS-CW | Excellent reliability and stitch bond | QFN,QFP,BGA,SOP,SOT,TO,LED Package |
| WS-SCW | High performance ,good mechanical | Fine pitch , High Pin | |
| 5N | WS-CW | Good ball shape, good anti-oxidation | Power Devices,Discrete,Power SOIC |
| WS-SCW | Excellent bond reliability,soft FAB | Thin aluminum pad | |
| Wire Diameter | Cu wire 0.7mil |
| Bonder | KNS wire bonder &Cu kit |
| Capillary (PECO) | B0708.5-26-11.5-05 |
| Heater Temp. | 180 ℃ |
| BPO(μm) | 51X67 |
| Substrate | PCB |
| Gas | Forming 0.6l/min |
| EFO Fire Time (μs) | 270 |
| EFO Current (mA) | 28 |
| EFO Gap(μm) | 20 |
| Tail Extension(μm) | 5 |
Mechanical Properties
| Dia | EL(%) | BL(gf) | |||||||
| mil | um | 4N | 5N | 4N | 5N | ||||
| WS-CW | WS-SCW | WS-CW | WS-SCW | WS-CW | WS-SCW | WS-CW | WS-SCW | ||
| 0.6 | 15 | 3-15 | 3-15 | 3-16 | 3-17 | >3.0 | >3.0 | >3.0 | >3.0 |
| 0.7 | 18 | 3-17 | 3-17 | 3-18 | 4-19 | >3.0 | >3.0 | >3.5 | >4.0 |
| 0.8 | 20 | 4-18 | 4-18 | 4-19 | 5-20 | >4.0 | >4.5 | >5.0 | >5.0 |
| 0.9 | 23 | 6-20 | 6-20 | 6-21 | 6-22 | >5.0 | >6.0 | >6.0 | >6.5 |
| 1.0 | 25 | 8-22 | 8-23 | 8-24 | 8-24 | >6.0 | >7.0 | >7.0 | >8.0 |
| 1.2 | 30 | 9-23 | 9-24 | 9-25 | 9-26 | >8.0 | >8.5 | >8.0 | >10.0 |
| 1.3 | 33 | 9-24 | 10-25 | 10-26 | 10-27 | >10.0 | >11.0 | >10.0 | >12.0 |
| 1.5 | 38 | 10-25 | 10-26 | 10-27 | 11-28 | >12.0 | >12.0 | >12.0 | >14.0 |
| 1.7 | 43 | 10-26 | 11-28 | 10-30 | 11-30 | >15.0 | >16.0 | >15.0 | >18.0 |
| 2.0 | 50 | 12-28 | 12-30 | 12-32 | 12-34 | >20.0 | >20.0 | >20.0 | >20.0 |
TDS for Au Wire
| Main Purity | 4N Cu | 5N Cu | PCC or AuPCC | |
| Wire Type | WC/SCW | WC/SCW | PCC or AuPCC | |
| Hardness(Hv) | FAB | 42 ~47 | 40 ~45 | 40 ~ 50 |
| Wire | 47 ~52 | 45 ~50 | 50 ~ 60 | |
| Fusing Current(A)(±0.02A,Length=10mm) | 0.3 ~ 2.2 | 0.3 ~ 2.2 | 0.3 ~ 2.2 | |
| Resistivity(uΩ Cm) | 1.7 | 1.7 | 1.9 | |
| Recrystalization Temp.(℃) | 350 ~ 600 | 350 ~ 600 | 350 ~600 | |
| Elastic Modulus(Gpa) | 60 ~ 85 | 60 ~ 85 | 60 ~85 | |
| Melting Point(℃) | 1050 ~1100 | 1050 ~1100 | 1050 ~1100 | |
| Density(gr/㎤) | 8.96 | 8.96 | 8.99/8.98 | |
| Cofficient of Linear thermal Expansion(20~100℃) | 16 ~ 18 x 10-6 | 16 ~ 18 x 10-6 | 16 ~ 18 x 10-6 | |
| Shelf Life(From data of Manufacturing/day) | 6 Months | 6 Months | 6 Months | |
| Floor Life(Opened from barrier bag) | 2 Weeks | 2 Weeks | 4 Weeks | |
Product Application
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BST and BPT |
FAB Image |
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| Copper Wire | |
