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Silver Alloy Bonding Wire

• Low resistivity
• Cost effective
• High reliability and bondability
• Long shelf time
• High reflectivity in short wave length range
• Softer FAB

Classification

Classification Characteristics Areas of application
WS-SAG9 Good Reflecton,Soft

QFP、BGA、Discrete、SOP、QFN、TSOP、SOT, LED PACKAGE

WS-HGS8 High performance
WS-SAG5 Low resistivity
WS-SAG2 Softer FAB

Mechanical Properties

Dia EL(%) BL(gf)
mil um WS-SAG9 WS-HGS8 WS-SAG5 WS-SAG2 WS-SAG9 WS-HGS8 WS-SAG5 WS-SAG2
0.6 15 5-10 2-9 5-10 5-10 >3.0 >4.0 >3.5 >4.0
0.7 18 7-13 2-9 7-13 7-13 >4.0 >4.0 >4.0 >5.0
0.8 20 7-13 2-9 7-13 7-13 >6.0 >6.0 >6.0 >6.0
0.9 23 7-13 2-9 7-13 7-13 >8.0 >8.0 >8.0 >8.0
1.0 25 7-13 2-9 7-13 7-13 >10.0 >10.0 >10.0 >10.0
1.2 30 8-15 3-12 8-15 8-15 >14.0 >13.0 >13.0 >15.0

TDS for Au Wire

Main Purity

Ag 99%

Ag97%

Ag95%

Ag92%

Ag88%

Wire Type

SAG9

SAG7

SAG5

SAG2

HGS8

Hardness(Hv)

FAB

35 ~ 45

40 ~ 50

45 ~ 55

45-55

45 ~ 55


Wire

45 ~ 55

50 ~ 60

55 ~ 65

55-68

60 ~ 70

Fusing Current(A)(±0.02A,Length=10mm)

0.29 ~ 1.20

 0.30 ~ 1.25

0.31 ~ 1.34

0.31-1.31

0.31 ~ 1.32

Resistivity(uΩ Cm)

2.2 

3.1 

3.2

3.9

4.6

Recrystalization Temp.(℃)

410~480

410~480

410~480

410~480

410~480

Elastic Modulus(Gpa)

75 ~ 90

75 ~ 90

75 ~ 90

75 ~ 90

75 ~ 90

Melting Point(℃)

980 ~ 1010

980 ~ 1010

980 ~ 1010

980 ~ 1010

980 ~ 1010

Density(gr/㎤)

10.31

10.61

10.63

10.68

10.94

Cofficient of Linear thermal Expansion(20~100℃)

18~20 x 10-6

18~20 x 10-6

18~20 x 10-6

18~20 x 10-6

18~20 x 10-6

Shelf Life(From data of Manufacturing/day)

12Months

12Months

12Months

12Months

12Months

Floor Life(Opened from barrier bag)

2Weeks

2Weeks

2Weeks

12Months

2Weeks

Product application

FBump Ball Application
Ag Alloy Wire
Address:NO.66,Jinfu Road,Baoshan District,Shanghai   Email:ls@shwonsung.com   hch@shwonsung.com    cz@shwonsung.com
Contact:Jack Liu 13801702414 / Jimmy Hu 13916223063 / Jason Chen18317138794
Phone:021-51281028-821 Fax:021-51281028
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